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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | THGBMHG9C8LBAAG |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: BGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | THGBMHG9C8LBAAG Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Memory Density: | 549755813888 bit |
| Organization: | 64GX8 |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Words: | 68719476736 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| No. of Words Code: | 64G |
| JESD-30 Code: | R-PBGA-B |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Temperature Grade: | INDUSTRIAL |
