Toshiba - THGBMHG9C8LBAU8

THGBMHG9C8LBAU8 by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number THGBMHG9C8LBAU8
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B153;
Datasheet THGBMHG9C8LBAU8 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Memory Density: 549755813888 bit
Organization: 64GX8
Surface Mount: YES
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
No. of Terminals: 153
No. of Words: 68719476736 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
No. of Words Code: 64G
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
Temperature Grade: INDUSTRIAL
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