Toshiba - THM368020SG-80

  1. Home
  2. Toshiba - THM368020SG-80
THM368020SG-80 by Toshiba

Image shown is a representation only.

Manufacturer Toshiba
Manufacturer's Part Number THM368020SG-80
Description DRAM MODULE; Memory Width: 36; No. of Functions: 1; No. of Ports: 1; No. of Words: 8388608 words; Maximum Access Time: 80 ns;
Datasheet THM368020SG-80 Datasheet
NAME DESCRIPTION
No. of Functions: 1
No. of Ports: 1
No. of Words: 8388608 words
Qualification: Not Qualified
Memory Density: 301989888 bit
Organization: 8MX36
Maximum Access Time: 80 ns
No. of Words Code: 8M
Memory IC Type: DRAM MODULE
Memory Width: 36
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

W631GU6NB09I by Winbond Electronics

W631GU6NB09I

Winbond Electronics

Winbond Electronics' W631GU6NB09I is a DDR3L DRAM with 64MX16 organization, operating at 1066 MHz. Featuring synchronous mode and self-refresh capability, it has a memory density of 1073741824 bit. Ideal for industrial applications requiring high-speed data processing in compact devices.
IS46TR16256AL-125KBLA2 by Integrated Silicon Solution

IS46TR16256AL-125KBLA2

Integrated Silicon Solution

IS46TR16256AL-125KBLA2 by Integrated Silicon Solution is a 256MX16 DDR3L DRAM with 800 MHz clock frequency. Operating at 1.35V, it offers 8192 refresh cycles and supports multi-bank page burst access mode. Ideal for industrial applications requiring high memory density and fast data processing.
NT5CC256M16EP-EKT by Nanya Technology

NT5CC256M16EP-EKT

Nanya Technology

NT5CC256M16EP-EKT by Nanya Technology is a DDR3L DRAM with 256MX16 organization and 4294967296 bit memory density. It operates at a voltage of 1.35V, has a temperature range of -40 to 95 °C, and is suitable for industrial applications.
IS42S16100H-7TLI-TR by Integrated Silicon Solution

IS42S16100H-7TLI-TR

Integrated Silicon Solution

IS42S16100H-7TLI-TR by Integrated Silicon Solution is a 1MX16 Synchronous DRAM with 16-bit memory width. Operating at 3.3V, it features dual bank page burst access mode and self-refresh capability. Ideal for industrial applications requiring fast data access with a max operating temperature of 85°C.
MT46H128M16LFDD-48IT:C by Micron Technology

MT46H128M16LFDD-48IT:C

Micron Technology

Micron Technology's MT46H128M16LFDD-48IT:C is a 128MX16 LPDDR1 DRAM with 1.8V supply, operating at up to 208MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring fast memory access and low power consumption.
IS42S16400J-7BLI by Integrated Silicon Solution

IS42S16400J-7BLI

Integrated Silicon Solution

IS42S16400J-7BLI by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with 3.3V supply voltage, 143 MHz clock frequency, and 85°C max temp. Ideal for industrial applications requiring fast memory access, it features self-refresh mode, common I/O type, and thin profile grid array package.
S27KS0642GABHI030 by Infineon Technologies

S27KS0642GABHI030

Infineon Technologies

Infineon's S27KS0642GABHI030 is a 8MX8 DRAM with 67108864 bit memory density. Operating at 200 MHz, it features synchronous mode and self-refresh capability. Ideal for applications requiring fast data access and low power consumption in compact devices.
K4S281632K-UC60 by Samsung

K4S281632K-UC60

Samsung

Samsung's K4S281632K-UC60 is a 8MX16 DRAM with 200 MHz clock frequency. It operates synchronously at 3.3V, featuring 70°C max temp. Ideal for applications requiring high-speed memory access and low power consumption.
K4B1G1646E-HCF8 by Samsung

K4B1G1646E-HCF8

Samsung

Samsung's K4B1G1646E-HCF8 DDR3 DRAM features 64MX16 organization, 533 MHz clock frequency, and 1073741824 bit memory density. Ideal for high-performance computing applications requiring fast data processing and storage capabilities.
K4S511632D-UC75 by Samsung

K4S511632D-UC75

Samsung

Samsung's K4S511632D-UC75 is a 32MX16 DRAM with 3.3V supply, operating at 133MHz. Ideal for commercial applications, it features synchronous operation, self-refresh capability, and a small outline package style.
IS42S32800J-6BLI by Integrated Silicon Solution

IS42S32800J-6BLI

Integrated Silicon Solution

IS42S32800J-6BLI by Integrated Silicon Solution is an 8MX32 Synchronous DRAM with 166 MHz clock frequency. It operates at 3.3V, has a temperature range of -40 to 85 °C, and features a thin profile grid array package. Ideal for industrial applications requiring high-speed memory access and low standby current consumption.
K4D26323RA-GC2A by Samsung

K4D26323RA-GC2A

Samsung

Samsung's K4D26323RA-GC2A is a DDR1 DRAM with 4MX32 organization, operating at 350 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in commercial temperature environments.
KM41C4000BSLP-8 by Samsung

KM41C4000BSLP-8

Samsung

Samsung's KM41C4000BSLP-8 is a 4MX1 DRAM with 4194304-bit memory density. It operates asynchronously at 5V, featuring a max access time of 80ns and refresh cycles of 1024. Ideal for applications requiring fast page access in commercial temperature grades.
S27KL0642DPBHB020 by Cypress Semiconductor

S27KL0642DPBHB020

Cypress Semiconductor

HYPERRAM; No. of Terminals: 24; Package Code: VBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1 mm; Terminal Pitch: 1 mm;
MT53D1024M32D4DT-046WT:D by Micron Technology

MT53D1024M32D4DT-046WT:D

Micron Technology

Micron Technology's MT53D1024M32D4DT-046WT:D is a LPDDR4 DRAM with 1GX32 organization, 1073741824 words capacity, and 2136.7 MHz clock frequency. It operates synchronously at 1.8V for applications requiring high-speed memory access in compact devices like smartphones and tablets.
MT40A512M16TB-062E:J by Micron Technology

MT40A512M16TB-062E:J

Micron Technology

Micron Technology's MT40A512M16TB-062E:J is a DDR4 DRAM with 512MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for applications requiring high memory density and fast data access in thin-profile devices.
S27KL0642GABHB023 by Infineon Technologies

S27KL0642GABHB023

Infineon Technologies

Infineon's S27KL0642GABHB023 DRAM features 8MX8 organization, operates synchronously at up to 200 MHz, and has a memory density of 67108864 bits. Ideal for automotive applications due to AEC-Q100 screening level and common I/O type.
KM44C1000BLJ-6 by Samsung

KM44C1000BLJ-6

Samsung

Samsung's KM44C1000BLJ-6 is a 1MX4 DRAM with 1048576 words and 4194304 bit memory density. Operating at 5V, it offers a max access time of 60ns for fast page access applications. With a package size of 17.145mm x 7.62mm x 3.68mm, this CMOS technology-based chip is ideal for commercial temperature grade environments.
MT48LC8M16A2TG-8E by Micron Technology

MT48LC8M16A2TG-8E

Micron Technology

Micron Technology's MT48LC8M16A2TG-8E is a 3.3V Synchronous DRAM with 8MX16 organization, operating at up to 125 MHz clock frequency. It features common I/O type, self-refresh mode, and supports four-bank page burst access. Ideal for commercial applications requiring high-speed memory performance in a compact thin profile package.
IS43TR16128C-15HBL by Integrated Silicon Solution

IS43TR16128C-15HBL

Integrated Silicon Solution

IS43TR16128C-15HBL by Integrated Silicon Solution is a DDR3 DRAM with 128MX16 organization, operating at 1.5V. It features synchronous operation, self-refresh capability, and multi-bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in electronic devices.