Toshiba - THM402020ASG-70

  1. Home
  2. Toshiba - THM402020ASG-70
THM402020ASG-70 by Toshiba

Image shown is a representation only.

Manufacturer Toshiba
Manufacturer's Part Number THM402020ASG-70
Description DRAM MODULE; Qualification: Not Qualified; Organization: 2MX40; Maximum Access Time: 70 ns; Memory Density: 83886080 bit; No. of Words Code: 2M;
Datasheet THM402020ASG-70 Datasheet
NAME DESCRIPTION
No. of Functions: 1
No. of Ports: 1
No. of Words: 2097152 words
Qualification: Not Qualified
Memory Density: 83886080 bit
Organization: 2MX40
Maximum Access Time: 70 ns
No. of Words Code: 2M
Memory IC Type: DRAM MODULE
Memory Width: 40
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

W631GU6NB11I by Winbond Electronics

W631GU6NB11I

Winbond Electronics

Winbond Electronics' W631GU6NB11I is a DDR3L DRAM with 64MX16 organization, operating at up to 933 MHz. Featuring synchronous mode and self-refresh capability, it has a memory density of 1073741824 bit. Ideal for industrial applications requiring high-speed data processing in compact devices.
K4S641632K-UC75 by Samsung

K4S641632K-UC75

Samsung

Samsung's K4S641632K-UC75 is a 4MX16 DRAM with 3.3V supply, operating at 133MHz clock frequency. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability. Package style: small outline, thin profile, suitable for commercial temperature grade environments.
MT48LC32M16A2TG-75IT:C by Alliance Memory

MT48LC32M16A2TG-75IT:C

Alliance Memory

SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT47H32M16NF-25EAAT:H by Micron Technology

MT47H32M16NF-25EAAT:H

Micron Technology

Micron Technology's MT47H32M16NF-25EAAT:H is a DDR2 DRAM with 32MX16 organization, operating at 400 MHz. It features a 1.8V supply voltage, industrial temperature grade, and supports synchronous operation. Ideal for applications requiring high-speed memory access in automotive and industrial environments.
MTA36ASF4G72PZ-2G3B1 by Micron Technology

MTA36ASF4G72PZ-2G3B1

Micron Technology

Micron Technology's MTA36ASF4G72PZ-2G3B1 is a 4GX72 DDR DRAM MODULE with 309.2 Gb memory density and operates at 1.2V. It features synchronous operation, self-refresh capability, and dual bank page burst access mode. Ideal for high-performance computing applications requiring reliable and fast memory solutions.
IS42S83200G-7BLI-TR by Integrated Silicon Solution

IS42S83200G-7BLI-TR

Integrated Silicon Solution

IS42S83200G-7BLI-TR by Integrated Silicon Solution is a 32MX8 Synchronous DRAM with 3.3V supply, 85°C max temp, and 143 MHz clock frequency. Ideal for industrial applications requiring high memory density and fast access times.
KVR16LS11/8 by Kingston Technology Company

KVR16LS11/8

Kingston Technology Company

Kingston KVR16LS11/8 is a 1.35V DDR DRAM module with 1GX64 organization, operating at up to 800MHz clock frequency. It features 204 terminals in a rectangular package suitable for microelectronic assembly. Ideal for applications requiring high memory density and fast data access within the temperature range of 0-85°C.
A43L2616BV-7UF by Amic Technology

A43L2616BV-7UF

Amic Technology

A43L2616BV-7UF by Amic Technology is a 4MX16 DRAM with 3.3V supply, operating at 143MHz clock frequency. Ideal for industrial applications, it features synchronous operation, self-refresh capability, and common I/O type in a small outline package.
MT41K256M16HA-125IT by Micron Technology

MT41K256M16HA-125IT

Micron Technology

Micron Technology's MT41K256M16HA-125IT is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access for high-speed memory applications in various electronic devices.
MT40A1G16RC-062EIT:BTR by Micron Technology

MT40A1G16RC-062EIT:BTR

Micron Technology

DDR4 DRAM; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;
MT53E512M32D1ZW-046AUT:B by Micron Technology

MT53E512M32D1ZW-046AUT:B

Micron Technology

MT53E512M32D1ZW-046AUT:B by Micron Technology is a 512MX32 LPDDR4 DRAM with a clock frequency of 2133 MHz. It operates synchronously, has a common input/output type, and is suitable for applications requiring high memory density and low power consumption.
MT41K256M16HA-125 by Micron Technology

MT41K256M16HA-125

Micron Technology

Micron Technology's MT41K256M16HA-125 is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access. Ideal for applications requiring high memory density and fast data processing in compact devices due to its thin profile and fine pitch package style.
IS42S16320F-7TLI-TR by Integrated Silicon Solution

IS42S16320F-7TLI-TR

Integrated Silicon Solution

IS42S16320F-7TLI-TR by Integrated Silicon Solution is a 32MX16 Synchronous DRAM with 536870912-bit memory density. Operating at 3.3V, it features a max access time of 5.4ns and supports four bank page burst access mode. Ideal for industrial applications requiring high-speed memory performance in compact spaces.
M378B5673FH0-CH9 by Samsung

M378B5673FH0-CH9

Samsung

Samsung M378B5673FH0-CH9 DDR DRAM MODULE features 256MX64 organization, operates at 667 MHz clock frequency, and has a memory width of 64. Ideal for high-performance computing applications requiring fast data processing and storage capabilities.
MT48LC16M16A2P-7EIT:DTR by Micron Technology

MT48LC16M16A2P-7EIT:DTR

Micron Technology

MT48LC16M16A2P-7EIT:DTR by Micron Technology is a 16MX16 Synchronous DRAM with 268MB memory density. It operates at 3.3V, has a max access time of 5.4ns, and is ideal for industrial applications requiring fast and reliable memory performance.
K4B1G1646G-BCH9 by Samsung

K4B1G1646G-BCH9

Samsung

Samsung's K4B1G1646G-BCH9 DDR3 DRAM features 64MX16 organization, 667 MHz clock frequency, and 67108864 words capacity. Ideal for high-performance applications requiring fast memory access and data processing with a max standby current of 0.01 Amp.
MT46H32M16LFBF-6LIT:B by Micron Technology

MT46H32M16LFBF-6LIT:B

Micron Technology

Micron Technology's MT46H32M16LFBF-6LIT:B is a DDR1 DRAM with 32MX16 organization, operating at 166 MHz. It features a 60-terminal grid array package, synchronous mode, and self-refresh capability. Ideal for industrial applications requiring fast access times and low power consumption.
MT53E2G32D4DE-046WT:C by Micron Technology

MT53E2G32D4DE-046WT:C

Micron Technology

LPDDR4 DRAM;
M378T6553EZS-CE6 by Samsung

M378T6553EZS-CE6

Samsung

Samsung M378T6553EZS-CE6 DDR DRAM Module features 64MX64 organization, operates at 333 MHz with 1.8V supply voltage. Ideal for applications requiring high-speed synchronous memory in microelectronic assemblies.
MT4C4001JDJ-6 by Micron Technology

MT4C4001JDJ-6

Micron Technology

Micron Technology's MT4C4001JDJ-6 is a 1MX4 DRAM with 1048576 words, 60ns access time, and 4194304-bit memory density. It is used in fast page applications requiring common I/O type and operates at a nominal voltage of 5V.