
Image shown is a representation only.
Manufacturer | Toshiba |
---|---|
Manufacturer's Part Number | TMP1962C10BXBG |
Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 281; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | TMP1962C10BXBG Datasheet |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.35 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.5 V |
Integrated Cache: | NO |
Maximum Seated Height: | 1.4 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Maximum Supply Current: | 46 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 281 |
Terminal Position: | BOTTOM |
Format: | FIXED POINT |
Package Style (Meter): | GRID ARRAY |
Address Bus Width: | 24 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B281 |
Maximum Clock Frequency: | 13.5 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Width: | 13 mm |
Speed: | 40.5 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.65 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 16 |
Bit Size: | 32 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -20 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA281,18X18,25 |
Length: | 13 mm |
Additional Features: | LOW POWER TAKEN FROM STANDBY MODE |
Terminal Pitch: | .65 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 1.5,2.5,3,3.3 |