Image shown is a representation only.
| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | TMPR3912XB-75 |
| Description | MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 217; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | TMPR3912XB-75 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Integrated Cache: | YES |
| Maximum Seated Height: | 1.4 mm |
| Sub-Category: | Microprocessors |
| Surface Mount: | YES |
| Maximum Supply Current: | 130 mA |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 217 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Address Bus Width: | 13 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B217 |
| Maximum Clock Frequency: | 9.216 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LFBGA |
| Width: | 13 mm |
| Speed: | 75 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 3.6 V |
| Low Power Mode: | YES |
| Boundary Scan: | NO |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA217,15X15,32 |
| Length: | 13 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 3.3 |
