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| Manufacturer | Winbond Electronics |
|---|---|
| Manufacturer's Part Number | W25Q20EWSVIG |
| Description | FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: VSOP; Package Shape: RECTANGULAR; Width: 3.9 mm; |
| Datasheet | W25Q20EWSVIG Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .0000075 Amp |
| Organization: | 2MX1 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .9 mm |
| Programming Voltage (V): | 1.8 |
| Minimum Supply Voltage (Vsup): | 1.65 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 20 mA |
| No. of Terminals: | 8 |
| Maximum Clock Frequency (fCLK): | 104 MHz |
| No. of Words: | 2097152 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, VERY THIN PROFILE |
| Write Protection: | HARDWARE/SOFTWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 100000 Write/Erase Cycles |
| Package Code: | VSOP |
| Width: | 3.9 mm |
| Serial Bus Type: | SPI |
| Memory Density: | 2097152 bit |
| Memory IC Type: | FLASH |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSOP8,.25 |
| Length: | 4.9 mm |
| No. of Words Code: | 2M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Minimum Data Retention Time: | 20 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 1.95 V |
| Power Supplies (V): | 1.8 |
