Xilinx - XA3S400-4FG456Q

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XA3S400-4FG456Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA3S400-4FG456Q
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;
Datasheet XA3S400-4FG456Q Datasheet
In Stock346
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 264
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 264
Position Of Terminal: Bottom
No. of Terminals: 456
Package Style (Meter): Grid Array
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B456
Maximum Clock Frequency: 125 MHz
Package Shape: Square
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
No. of Logic Cells: 8064
JESD-609 Code: e0
Qualification: No
Package Equivalence Code: BGA456,22X22,40
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1.2,1.2/3.3,2.5 V
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