Xilinx - XA6SLX9-2FTG256Q

XA6SLX9-2FTG256Q by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA6SLX9-2FTG256Q
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 186;
Datasheet XA6SLX9-2FTG256Q Datasheet
In Stock464
NAME DESCRIPTION
Package Body Material: Plastic
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 186
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 186
Position Of Terminal: Bottom
No. of Terminals: 256
Package Style (Meter): Grid Array
Screening Level: AEC-Q100
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 62.5 MHz
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
No. of Logic Cells: 9152
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin Silver Copper
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.2,2.5/3.3 V
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Pricing (USD)

Qty. Unit Price Ext. Price
464 $52.660 $24,434.240

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