Xilinx - XA7Z030-1FBG484I

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XA7Z030-1FBG484I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XA7Z030-1FBG484I
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Ultraviolet Erasable: N;
Datasheet XA7Z030-1FBG484I Datasheet
In Stock472
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Ultraviolet Erasable: N
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.54 mm
Sub-Category: Other uPs/uCs/Peripheral ICs
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 484
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B484
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
JESD-609 Code: e1
Qualification: Not Qualified
Package Equivalence Code: BGA484,22X22,40
Length: 23 mm
Peak Reflow Temperature (C): 250
Terminal Pitch: 1 mm
Power Supplies (V): 1,1.8
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