Xilinx - XC17512LPCG20C

XC17512LPCG20C by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XC17512LPCG20C
Description CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Terminal Form: J BEND;
Datasheet XC17512LPCG20C Datasheet
In Stock348
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 512KX1
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 4.572 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Terminal Finish: MATTE TIN
No. of Terminals: 20
No. of Words: 524288 words
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER
Technology: CMOS
JESD-30 Code: S-PQCC-J20
Package Shape: SQUARE
Terminal Form: J BEND
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: QCCJ
Width: 8.9662 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 524288 bit
Memory IC Type: CONFIGURATION MEMORY
JESD-609 Code: e3
Minimum Operating Temperature: 0 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
Length: 8.9662 mm
No. of Words Code: 512K
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Peak Reflow Temperature (C): 245
Parallel or Serial: SERIAL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
348 - -

Popular Products

Category Top Products