Xilinx - XC1765DDDG8M

XC1765DDDG8M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC1765DDDG8M
Description MEMORY CIRCUIT; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 64K;
Datasheet XC1765DDDG8M Datasheet
In Stock364
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Organization: 64KX1
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: NO
Terminal Finish: MATTE TIN
No. of Terminals: 8
No. of Words: 65536 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-GDIP-T8
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Width: 7.62 mm
Memory Density: 65536 bit
Memory IC Type: MEMORY CIRCUIT
JESD-609 Code: e3
Minimum Operating Temperature: -55 Cel
Memory Width: 1
No. of Functions: 1
Qualification: Not Qualified
Length: 10.16 mm
No. of Words Code: 64K
Nominal Supply Voltage / Vsup (V): 5
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 5.5 V
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