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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC18V02PCG44C |
| Description | CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; |
| Datasheet | XC18V02PCG44C Datasheet |
| In Stock | 52 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .01 Amp |
| Organization: | 256KX8 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 4.572 mm |
| Minimum Supply Voltage (Vsup): | 3 V |
| Sub-Category: | Flash Memories |
| Surface Mount: | YES |
| Maximum Supply Current: | 25 mA |
| Terminal Finish: | Matte Tin (Sn) |
| No. of Terminals: | 44 |
| Maximum Clock Frequency (fCLK): | 20 MHz |
| No. of Words: | 262144 words |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| Technology: | CMOS |
| JESD-30 Code: | S-PQCC-J44 |
| Package Shape: | SQUARE |
| Terminal Form: | J BEND |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 20000 Write/Erase Cycles |
| Package Code: | QCCJ |
| Width: | 16.5862 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 2097152 bit |
| Memory IC Type: | CONFIGURATION MEMORY |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LDCC44,.7SQ |
| Length: | 16.5862 mm |
| Maximum Access Time: | 20 ns |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Minimum Data Retention Time: | 20 |
| Peak Reflow Temperature (C): | 245 |
| Parallel or Serial: | PARALLEL/SERIAL |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 2.5/3.3,3.3 |
