Xilinx - XC2S15-5CSG144I

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XC2S15-5CSG144I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2S15-5CSG144I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
Datasheet XC2S15-5CSG144I Datasheet
In Stock229
NAME DESCRIPTION
Minimum Supply Voltage: 2.375 V
Package Body Material: Plastic/Epoxy
Organization: 96 CLBS, 15000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.7 ns
Maximum Seated Height: 1.2 mm
No. of Inputs: 90
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 86
Position Of Terminal: Bottom
No. of Terminals: 144
No. of Equivalent Gates: 15000
Package Style (Meter): Grid Array, Thin Profile, Fine Pitch
JESD-30 Code: S-PBGA-B144
Maximum Clock Frequency: 263 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: TFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 2.625 V
Nominal Supply Voltage (V): 2.5
No. of Logic Cells: 432
No. of CLBs: 96
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA144,13X13,32
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Length: 12 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
Power Supplies (V): 1.5/3.3,2.5 V
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