Xilinx - XC2VP50-8FF1517I

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XC2VP50-8FF1517I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC2VP50-8FF1517I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet XC2VP50-8FF1517I Datasheet
In Stock650
NAME DESCRIPTION
Minimum Supply Voltage: 1.425 V
Package Body Material: Plastic/Epoxy
Organization: 5648 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.4 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 1517
Package Style (Meter): Grid Array, Heat Sink/Slug
JESD-30 Code: S-PBGA-B1517
Package Shape: Square
Package Code: HBGA
Width: 40 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.575 V
Nominal Supply Voltage (V): 1.5
Technology Used: CMOS
No. of CLBs: 5648
JESD-609 Code: e0
Qualification: No
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 40 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
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