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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC3090-100PG175B |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: PIN/PEG; No. of Terminals: 175; Package Code: PGA; Package Shape: SQUARE; |
Datasheet | XC3090-100PG175B Datasheet |
In Stock | 500 |
NAME | DESCRIPTION |
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Package Body Material: | Ceramic, Metal-Sealed Cofired |
Organization: | 320 CLBS, 5000 Gates |
Maximum Combinatorial Delay of a CLB: | 7 ns |
Maximum Seated Height: | 4.318 mm |
No. of Inputs: | 144 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | No |
No. of Outputs: | 144 |
Position Of Terminal: | Perpendicular |
No. of Terminals: | 175 |
No. of Equivalent Gates: | 5000 |
Package Style (Meter): | Grid Array |
Screening Level: | MIL-STD-883 Class B |
JESD-30 Code: | S-CPGA-P175 |
Maximum Clock Frequency: | 100 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 125 °C (257 °F) |
Package Code: | PGA |
Width: | 42.164 mm |
Grading Of Temperature: | Military |
Programmable IC Type: | FPGA |
Nominal Supply Voltage (V): | 5 |
Technology Used: | CMOS |
No. of Logic Cells: | 320 |
No. of CLBs: | 320 |
Minimum Operating Temperature: | -55 °C (-67 °F) |
Qualification: | No |
Package Equivalence Code: | PGA175,16X16 |
Length: | 42.164 mm |
Form Of Terminal: | Pin/Peg |
Additional Features: | 928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA |
Pitch Of Terminal: | 2.54 mm |
Power Supplies (V): | 5 V |