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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC3090-100PG175I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: PIN/PEG; No. of Terminals: 175; Package Code: PGA; Package Shape: SQUARE; |
Datasheet | XC3090-100PG175I Datasheet |
In Stock | 328 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 4.5 V |
Package Body Material: | Ceramic, Metal-Sealed Cofired |
Organization: | 320 CLBS, 5000 Gates |
Maximum Combinatorial Delay of a CLB: | 7 ns |
Maximum Seated Height: | 3.81 mm |
No. of Inputs: | 144 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | No |
No. of Outputs: | 144 |
Position Of Terminal: | Perpendicular |
No. of Terminals: | 175 |
No. of Equivalent Gates: | 5000 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-CPGA-P175 |
Maximum Clock Frequency: | 100 MHz |
Package Shape: | Square |
Maximum Operating Temperature: | 85 °C (185 °F) |
Package Code: | PGA |
Width: | 42.164 mm |
Grading Of Temperature: | Industrial |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 5.5 V |
Nominal Supply Voltage (V): | 5 |
Technology Used: | CMOS |
No. of Logic Cells: | 320 |
No. of CLBs: | 320 |
Minimum Operating Temperature: | -40 °C (-40 °F) |
Qualification: | No |
Package Equivalence Code: | PGA176,16X16MOD |
Length: | 42.164 mm |
Form Of Terminal: | Pin/Peg |
Additional Features: | 928 flip-flops; typical gates = 5000-6000; power-down supplier current = 250 µA |
Pitch Of Terminal: | 2.54 mm |
Power Supplies (V): | 5 V |