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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC3S1500-5FG456I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V; |
Datasheet | XC3S1500-5FG456I Datasheet |
In Stock | 418 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.14 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 3328 CLBS, 1500000 Gates |
Maximum Time At Peak Reflow Temperature (s): | 30 s |
Maximum Seated Height: | 2.6 mm |
No. of Inputs: | 333 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | Yes |
No. of Outputs: | 333 |
Position Of Terminal: | Bottom |
No. of Terminals: | 456 |
No. of Equivalent Gates: | 1500000 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B456 |
Package Shape: | Square |
Package Code: | BGA |
Width: | 23 mm |
Moisture Sensitivity Level (MSL): | 3 |
Programmable IC Type: | FPGA |
Maximum Supply Voltage: | 1.26 V |
Nominal Supply Voltage (V): | 1.2 |
Technology Used: | CMOS |
No. of Logic Cells: | 29952 |
No. of CLBs: | 3328 |
JESD-609 Code: | e0 |
Qualification: | No |
Package Equivalence Code: | BGA456,22X22,40 |
Finishing Of Terminal Used: | Tin Lead |
Length: | 23 mm |
Form Of Terminal: | Ball |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 225 °C (437 °F) |
Power Supplies (V): | 1.2,1.2/3.3,2.5 V |