Xilinx - XC4010E-3BG225I

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XC4010E-3BG225I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC4010E-3BG225I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 160;
Datasheet XC4010E-3BG225I Datasheet
In Stock318
NAME DESCRIPTION
Minimum Supply Voltage: 4.5 V
Package Body Material: Plastic/Epoxy
Organization: 400 CLBS, 7000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 2 ns
Maximum Seated Height: 2.55 mm
No. of Inputs: 160
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 160
Position Of Terminal: Bottom
No. of Terminals: 225
No. of Equivalent Gates: 7000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B225
Maximum Clock Frequency: 125 MHz
Package Shape: Square
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA
Maximum Supply Voltage: 5.5 V
Nominal Supply Voltage (V): 5
Technology Used: CMOS
No. of Logic Cells: 400
No. of CLBs: 400
JESD-609 Code: e0
Qualification: No
Package Equivalence Code: BGA225,15X15
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 27 mm
Form Of Terminal: Ball
Additional Features: Max usable 10000 Logic gates
Pitch Of Terminal: 1.5 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 5 V
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