Xilinx - XC4052XLA-09BGG560C

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XC4052XLA-09BGG560C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC4052XLA-09BGG560C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC4052XLA-09BGG560C Datasheet
In Stock80
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: Plastic/Epoxy
Organization: 1936 CLBS, 33000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.1 ns
Maximum Seated Height: 1.7 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 560
No. of Equivalent Gates: 33000
Package Style (Meter): Grid Array, Low Profile
JESD-30 Code: S-PBGA-B560
Maximum Clock Frequency: 227 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LBGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
No. of CLBs: 1936
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 42.5 mm
Form Of Terminal: Ball
Additional Features: Can also use 100000 gates
Pitch Of Terminal: 1.27 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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