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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC4VFX12-10SF363CS1 |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA363,20X20,32; |
| Datasheet | XC4VFX12-10SF363CS1 Datasheet |
| In Stock | 1,032 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | Plastic/Epoxy |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| No. of Inputs: | 240 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 240 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 363 |
| Package Style (Meter): | Grid Array, Fine Pitch |
| JESD-30 Code: | S-PBGA-B363 |
| Maximum Clock Frequency: | 1028 MHz |
| Package Shape: | Square |
| Package Code: | FBGA |
| Moisture Sensitivity Level (MSL): | 4 |
| Programmable IC Type: | FPGA |
| Technology Used: | CMOS |
| No. of Logic Cells: | 12312 |
| JESD-609 Code: | e0 |
| Qualification: | No |
| Package Equivalence Code: | BGA363,20X20,32 |
| Finishing Of Terminal Used: | Tin/Lead (Sn63Pb37) |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | .8 mm |
| Peak Reflow Temperature (C): | 225 °C (437 °F) |
| Power Supplies (V): | 1.2,1.2/3.3,2.5 V |









