Xilinx - XC4VSX25-11FFG676C

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XC4VSX25-11FFG676C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC4VSX25-11FFG676C
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA676,26X26,40;
Datasheet XC4VSX25-11FFG676C Datasheet
In Stock67
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Programmable IC Type: FPGA
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 320
Technology Used: CMOS
Sub-Category: Field Programmable Gate Arrays
No. of Logic Cells: 23040
Surface Mount: Yes
JESD-609 Code: e1
No. of Outputs: 320
Position Of Terminal: Bottom
No. of Terminals: 676
Qualification: No
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B676
Form Of Terminal: Ball
Package Shape: Square
Pitch Of Terminal: 1 mm
Package Code: BGA
Peak Reflow Temperature (C): 250 °C (482 °F)
Moisture Sensitivity Level (MSL): 4
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