Xilinx - XC5VLX30-3FF324I

XC5VLX30-3FF324I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC5VLX30-3FF324I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet XC5VLX30-3FF324I Datasheet
In Stock360
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of Inputs: 400
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 400
Position Of Terminal: Bottom
No. of Terminals: 324
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B324
Maximum Clock Frequency: 710 MHz
Package Shape: Square
Package Code: BGA
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Technology Used: CMOS
No. of Logic Cells: 2400
JESD-609 Code: e0
Qualification: No
Package Equivalence Code: BGA324,18X18,40
Finishing Of Terminal Used: Tin Lead
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1,2.5 V
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Pricing (USD)

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360 - -

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