Xilinx - XC7K325T-1FB900I

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XC7K325T-1FB900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7K325T-1FB900I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet XC7K325T-1FB900I Datasheet
In Stock489
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: Plastic/Epoxy
Organization: 25475 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.74 ns
Maximum Seated Height: 2.54 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 900
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Package Shape: Square
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.03 V
Nominal Supply Voltage (V): 1
No. of CLBs: 25475
JESD-609 Code: e0
Finishing Of Terminal Used: Tin Lead
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
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Pricing (USD)

Qty. Unit Price Ext. Price
489 $2,469.980 $1,207,820.220

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