Xilinx - XC7K325T-2LFBG900C

XC7K325T-2LFBG900C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7K325T-2LFBG900C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC7K325T-2LFBG900C Datasheet
In Stock230
NAME DESCRIPTION
Minimum Supply Voltage: .87 V
Package Body Material: Plastic/Epoxy
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.61 ns
Maximum Seated Height: 2.54 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 900
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: .93 V
Nominal Supply Voltage (V): 0.9
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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Pricing (USD)

Qty. Unit Price Ext. Price
230 - -

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