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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XC7K355T-1FF901I |
| Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY; |
| Datasheet | XC7K355T-1FF901I Datasheet |
| In Stock | 1,334 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | Plastic/Epoxy |
| Maximum Time At Peak Reflow Temperature (s): | 30 s |
| No. of Inputs: | 300 |
| Sub-Category: | Field Programmable Gate Arrays |
| Surface Mount: | Yes |
| No. of Outputs: | 300 |
| Position Of Terminal: | Bottom |
| No. of Terminals: | 900 |
| Package Style (Meter): | Grid Array |
| JESD-30 Code: | S-PBGA-B900 |
| Maximum Clock Frequency: | 1818 MHz |
| Package Shape: | Square |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 4 |
| Programmable IC Type: | FPGA |
| Technology Used: | CMOS |
| No. of Logic Cells: | 356160 |
| JESD-609 Code: | e0 |
| Qualification: | No |
| Package Equivalence Code: | BGA900,30X30,40 |
| Finishing Of Terminal Used: | Tin Lead |
| Form Of Terminal: | Ball |
| Pitch Of Terminal: | 1 mm |
| Peak Reflow Temperature (C): | 225 °C (437 °F) |
| Power Supplies (V): | 1,1.8,3.3 V |









