Xilinx - XC7V2000T-1LFFG784C

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XC7V2000T-1LFFG784C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7V2000T-1LFFG784C
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;
Datasheet XC7V2000T-1LFFG784C Datasheet
In Stock364
NAME DESCRIPTION
Package Body Material: Plastic/Epoxy
Organization: 305400 CLBS
Programmable IC Type: FPGA
Maximum Time At Peak Reflow Temperature (s): 30 s
No. of CLBs: 305400
Surface Mount: Yes
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Position Of Terminal: Bottom
No. of Terminals: 784
Qualification: No
Finishing Of Terminal Used: Tin/Silver/Copper
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B784
Form Of Terminal: Ball
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Peak Reflow Temperature (C): 245 °C (473 °F)
Moisture Sensitivity Level (MSL): 4
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