Xilinx - XC7Z010-1CLG225E

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XC7Z010-1CLG225E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7Z010-1CLG225E
Description FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet XC7Z010-1CLG225E Datasheet
In Stock483
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 2200 CLBS, 430000 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 1.27 ns
Maximum Seated Height: 1.5 mm
No. of Inputs: 140
Surface Mount: Yes
No. of Outputs: 140
Position Of Terminal: Bottom
No. of Terminals: 225
No. of Equivalent Gates: 430000
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B225
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: LFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Programmable IC Type: FPGA SOC
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
No. of Logic Cells: 28000
No. of CLBs: 2200
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA225,15X15,32
Finishing Of Terminal Used: Tin Silver Copper
Length: 13 mm
Form Of Terminal: Ball
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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