Xilinx - XC7Z100-1FFG1156C

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XC7Z100-1FFG1156C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7Z100-1FFG1156C
Description SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
Datasheet XC7Z100-1FFG1156C Datasheet
In Stock355
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SYSTEM ON CHIP
Nominal Supply Voltage: 1 V
Maximum Supply Voltage: 1.05 V
Maximum Seated Height: 3.1 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 1156
Package Equivalence Code: BGA1156,34X34,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 35 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B1156
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 35 mm
Terminal Pitch: 1 mm
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