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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC7Z100-3FFG900E |
Description | FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm; |
Datasheet | XC7Z100-3FFG900E Datasheet |
In Stock | 431 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | Plastic/Epoxy |
Organization: | 34675 CLBS, 6600000 Gates |
Maximum Combinatorial Delay of a CLB: | 0.94 ns |
Maximum Seated Height: | 3.35 mm |
No. of Inputs: | 492 |
Surface Mount: | Yes |
No. of Outputs: | 492 |
Position Of Terminal: | Bottom |
No. of Terminals: | 900 |
No. of Equivalent Gates: | 6600000 |
Package Style (Meter): | Grid Array |
JESD-30 Code: | S-PBGA-B900 |
Package Shape: | Square |
Maximum Operating Temperature: | 100 °C (212 °F) |
Package Code: | BGA |
Width: | 31 mm |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FPGA SOC |
Maximum Supply Voltage: | 1.05 V |
Nominal Supply Voltage (V): | 1 |
No. of Logic Cells: | 444000 |
No. of CLBs: | 34675 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 °C (32 °F) |
Package Equivalence Code: | BGA900,30X30,40 |
Finishing Of Terminal Used: | Tin Silver Copper |
Length: | 31 mm |
Form Of Terminal: | Ball |
Additional Features: | PL block operates in 0.97V to 1.03V supply |
Pitch Of Terminal: | 1 mm |