Xilinx - XC6SLX75-2FGG484I

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XC6SLX75-2FGG484I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC6SLX75-2FGG484I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC6SLX75-2FGG484I Datasheet
In Stock186
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: Plastic/Epoxy
Organization: 5831 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.26 ns
Maximum Seated Height: 2.6 mm
No. of Inputs: 280
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 280
Position Of Terminal: Bottom
No. of Terminals: 484
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B484
Maximum Clock Frequency: 667 MHz
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 23 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 74637
No. of CLBs: 5831
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA484,22X22,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 23 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250 °C (482 °F)
Power Supplies (V): 1.2,2.5/3.3 V
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