Xilinx - XC7Z100-L1FFG900I

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XC7Z100-L1FFG900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7Z100-L1FFG900I
Description FPGA SOC; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 34675;
Datasheet XC7Z100-L1FFG900I Datasheet
In Stock360
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: Plastic/Epoxy
Organization: 34675 CLBS, 6600000 Gates
Maximum Combinatorial Delay of a CLB: 1.27 ns
Maximum Seated Height: 3.35 mm
No. of Inputs: 492
Surface Mount: Yes
No. of Outputs: 492
Position Of Terminal: Bottom
No. of Terminals: 900
No. of Equivalent Gates: 6600000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FPGA SOC
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
No. of Logic Cells: 444000
No. of CLBs: 34675
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 31 mm
Form Of Terminal: Ball
Additional Features: PL block operates in 0.97V to 1.03V supply
Pitch Of Terminal: 1 mm
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