Xilinx - XC8109-2BG225C

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XC8109-2BG225C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC8109-2BG225C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: BGA; Package Shape: SQUARE;
Datasheet XC8109-2BG225C Datasheet
In Stock417
NAME DESCRIPTION
Minimum Supply Voltage: 4.75 V
Package Body Material: Plastic/Epoxy
Organization: 2688 CLBS, 9000 Gates
Maximum Seated Height: 3.5 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 225
No. of Equivalent Gates: 9000
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B225
Package Shape: Square
Maximum Operating Temperature: 70 °C (158 °F)
Package Code: BGA
Width: 27 mm
Grading Of Temperature: Commercial
Programmable IC Type: FPGA
Maximum Supply Voltage: 5.25 V
Nominal Supply Voltage (V): 5
Technology Used: CMOS
No. of CLBs: 2688
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Length: 27 mm
Form Of Terminal: Ball
Additional Features: 1344 flip-flops; 3.3 V operation; OTP based
Pitch Of Terminal: 1.5 mm
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