Xilinx - XCKU060-1FFVA1156I

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XCKU060-1FFVA1156I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCKU060-1FFVA1156I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCKU060-1FFVA1156I Datasheet
In Stock677
NAME DESCRIPTION
Minimum Supply Voltage: .922 V
Package Body Material: Plastic/Epoxy
Organization: 2760 CLBS
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.51 mm
No. of Inputs: 624
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 624
Position Of Terminal: Bottom
No. of Terminals: 1156
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1156
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Industrial
Programmable IC Type: FPGA
Maximum Supply Voltage: .979 V
Nominal Supply Voltage (V): .95
No. of Logic Cells: 725550
No. of CLBs: 2760
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Package Equivalence Code: BGA1156,34X34,40
Finishing Of Terminal Used: Tin Silver Copper
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
Power Supplies (V): 0.95 V
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