Xilinx - XCKU15P-1FFVA1156E

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XCKU15P-1FFVA1156E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCKU15P-1FFVA1156E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCKU15P-1FFVA1156E Datasheet
In Stock5
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: Plastic/Epoxy
Organization: 65340 CLBs
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 3.71 mm
No. of Inputs: 668
Surface Mount: Yes
No. of Outputs: 668
Position Of Terminal: Bottom
No. of Terminals: 1156
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B1156
Package Shape: Square
Maximum Operating Temperature: 100 °C (212 °F)
Package Code: BGA
Width: 35 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: .876 V
Nominal Supply Voltage (V): 0.85
No. of Logic Cells: 1143450
No. of CLBs: 65340
JESD-609 Code: e1
Minimum Operating Temperature: 0 °C (32 °F)
Package Equivalence Code: BGA1156,34X34,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Length: 35 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245 °C (473 °F)
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