Xilinx - XCR3064XL-6CP56I

XCR3064XL-6CP56I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCR3064XL-6CP56I
Description EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 56; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XCR3064XL-6CP56I Datasheet
In Stock88
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 6 ns
Organization: 44 I/O
Maximum Seated Height: 1.35 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 56
No. of I/O Lines: 44
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: S-PBGA-B56
Maximum Clock Frequency: 167 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: LFBGA
Width: 6 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: EE PLD
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
JESD-609 Code: e0
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Finishing Of Terminal Used: Tin Lead
Length: 6 mm
Form Of Terminal: Ball
Output Function: Macrocell
Pitch Of Terminal: .5 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
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