Xilinx - XCR3128XL-6CSG144I

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XCR3128XL-6CSG144I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCR3128XL-6CSG144I
Description EE PLD; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
Datasheet XCR3128XL-6CSG144I Datasheet
In Stock240
NAME DESCRIPTION
Minimum Supply Voltage: 2.7 V
Package Body Material: Plastic/Epoxy
Propagation Delay: 6 ns
Organization: 104 I/O
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Seated Height: 1.2 mm
Surface Mount: Yes
Position Of Terminal: Bottom
No. of Terminals: 144
No. of I/O Lines: 104
Package Style (Meter): Grid Array, Thin Profile, Fine Pitch
JESD-30 Code: S-PBGA-B144
Maximum Clock Frequency: 167 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: TFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Industrial
Programmable IC Type: EE PLD
Maximum Supply Voltage: 3.6 V
Nominal Supply Voltage (V): 3.3
Technology Used: CMOS
JESD-609 Code: e1
Minimum Operating Temperature: -40 °C (-40 °F)
Qualification: No
Finishing Of Terminal Used: Tin Silver Copper
Length: 12 mm
Form Of Terminal: Ball
Output Function: Macrocell
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260 °C (500 °F)
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