Xilinx - XCV1000E-6FG860C

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XCV1000E-6FG860C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCV1000E-6FG860C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 860; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCV1000E-6FG860C Datasheet
In Stock272
NAME DESCRIPTION
Minimum Supply Voltage: 1.71 V
Package Body Material: Plastic/Epoxy
Organization: 6144 CLBS, 331776 Gates
Maximum Time At Peak Reflow Temperature (s): 30 s
Maximum Combinatorial Delay of a CLB: 0.47 ns
Maximum Seated Height: 2.2 mm
No. of Inputs: 660
Sub-Category: Field Programmable Gate Arrays
Surface Mount: Yes
No. of Outputs: 660
Position Of Terminal: Bottom
No. of Terminals: 860
No. of Equivalent Gates: 331776
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B860
Maximum Clock Frequency: 357 MHz
Package Shape: Square
Maximum Operating Temperature: 85 °C (185 °F)
Package Code: BGA
Width: 42.5 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: Other
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.89 V
Nominal Supply Voltage (V): 1.8
Technology Used: CMOS
No. of Logic Cells: 27648
No. of CLBs: 6144
JESD-609 Code: e0
Minimum Operating Temperature: 0 °C (32 °F)
Qualification: No
Package Equivalence Code: BGA860,42X42,40
Finishing Of Terminal Used: Tin/Lead (Sn63Pb37)
Length: 42.5 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 225 °C (437 °F)
Power Supplies (V): 1.2/3.6,1.8 V
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