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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCVC1502-2MSEVSVA2197 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1; |
Datasheet | XCVC1502-2MSEVSVA2197 Datasheet |
In Stock | 148 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .775 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | .8 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 4 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
No. of Terminals: | 2197 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B2197 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 110 Cel |
Package Code: | HBGA |
Width: | 45 mm |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | .825 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Package Equivalence Code: | BGA2197,47X47,36 |
Length: | 45 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .92 mm |