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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCVM1402-2MLIVSVD1760 |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V; |
| Datasheet | XCVM1402-2MLIVSVD1760 Datasheet |
| In Stock | 137 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .775 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | .8 V |
| Maximum Supply Voltage: | .825 V |
| Maximum Seated Height: | 4 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 1760 |
| Package Equivalence Code: | BGA1760,42X42,36 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 40 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B1760 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 110 Cel |
| Package Code: | HBGA |
| Width: | 40 mm |
| Terminal Pitch: | .92 mm |
