Xilinx - XCVM2302-2MLEVFVF1760

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XCVM2302-2MLEVFVF1760 by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCVM2302-2MLEVFVF1760
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
Datasheet XCVM2302-2MLEVFVF1760 Datasheet
In Stock377
NAME DESCRIPTION
Minimum Supply Voltage: .775 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .8 V
Maximum Supply Voltage: .825 V
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 1760
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B1760
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 110 Cel
Package Code: BGA
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