XCVP1802-2LLELSVC4072 by Xilinx | Peripheral ICs

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Manufacturer	Xilinx
Manufacturer's Part Number	XCVP1802-2LLELSVC4072
Description	MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 4072; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;
Datasheet	XCVP1802-2LLELSVC4072 Datasheet
In Stock	375

NAME	DESCRIPTION
Minimum Supply Voltage:	.676 V
Package Body Material:	PLASTIC/EPOXY
Peripheral IC Type:	MICROPROCESSOR CIRCUIT
Nominal Supply Voltage:	.7 V
Maximum Supply Voltage:	.724 V
Maximum Seated Height:	4.56 mm
Surface Mount:	YES
Minimum Operating Temperature:	0 Cel
No. of Terminals:	4072
Package Equivalence Code:	BGA4072,64X64,40
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, HEAT SINK/SLUG
Length:	65 mm
Technology:	CMOS
JESD-30 Code:	S-PBGA-B4072
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	110 Cel
Package Code:	HBGA
Width:	65 mm
Terminal Pitch:	1 mm

Pricing (USD)

Qty.	Unit Price	Ext. Price
375	-	-

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OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;

NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;