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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCVP2502-1MSIVSVB3340 |
Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage: .825 V; |
Datasheet | XCVP2502-1MSIVSVB3340 Datasheet |
In Stock | 213 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .775 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | .8 V |
Maximum Supply Voltage: | .825 V |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 3340 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B3340 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 110 Cel |
Package Code: | BGA |