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| Manufacturer | Xilinx |
|---|---|
| Manufacturer's Part Number | XCZU29DR-3FFVF1760E |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | XCZU29DR-3FFVF1760E Datasheet |
| In Stock | 405 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | .9 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 3.86 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 1760 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B1760 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Package Code: | BGA |
| Width: | 42.5 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| External Data Bus Width: | 0 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Package Equivalence Code: | BGA1760,42X42,40 |
| Length: | 42.5 mm |
| Peak Reflow Temperature (C): | 245 |
| Bus Compatibility: | CAN, I2C, PCI, SATA, SPI, UART, USB(2) |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | OTHER |
