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XCZU2EG-1LSFVA625I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU2EG-1LSFVA625I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;
Datasheet XCZU2EG-1LSFVA625I Datasheet
In Stock339
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.43 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 625
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B625
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: FBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
External Data Bus Width: 0
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA625,25X25,32
Length: 21 mm
Peak Reflow Temperature (C): 250
Bus Compatibility: CAN, I2C, SPI, UART
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
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