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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCZU3EG-2LSFVC784I |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE; |
Datasheet | XCZU3EG-2LSFVC784I Datasheet |
In Stock | 396 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | .85 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 3.32 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 784 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B784 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 100 Cel |
Package Code: | FBGA |
Width: | 23 mm |
Moisture Sensitivity Level (MSL): | 4 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
External Data Bus Width: | 0 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA784,28X28,32 |
Length: | 23 mm |
Peak Reflow Temperature (C): | 250 |
Bus Compatibility: | CAN, I2C, SPI, UART |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |