Xilinx - XCZU5EG-1FBVB900E

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XCZU5EG-1FBVB900E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU5EG-1FBVB900E
Description PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet XCZU5EG-1FBVB900E Datasheet
In Stock1,536
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.88 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 900
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B900
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: PROGRAMMABLE SoC
Maximum Supply Voltage: .876 V
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA900,30X30,40
Length: 31 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1 mm
Temperature Grade: OTHER
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