Xilinx - XCZU65DR-L1FFVE1156I

  1. Home
  2. Xilinx - XCZU65DR-L1FFVE1156I
XCZU65DR-L1FFVE1156I by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XCZU65DR-L1FFVE1156I
Description PROGRAMMABLE SoC;
Datasheet XCZU65DR-L1FFVE1156I Datasheet
In Stock319
NAME DESCRIPTION
Peripheral IC Type: PROGRAMMABLE SoC
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
319 - -

Popular Products

Category Top Products

MCIMX6X1AVO08AB by NXP Semiconductors

MCIMX6X1AVO08AB

NXP Semiconductors

MCIMX6X1AVO08AB by NXP Semiconductors is a System on Chip with 400 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.275V to 1.5V and uses CMOS technology. Ideal for automotive applications due to its low profile, fine pitch grid array package style.
MCIMX6S5EVM10AC by Freescale Semiconductor

MCIMX6S5EVM10AC

Freescale Semiconductor

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.5 mm;
MIMXRT1021CAF4A by NXP Semiconductors

MIMXRT1021CAF4A

NXP Semiconductors

NXP Semiconductors' MIMXRT1021CAF4A SoC offers peak reflow temp of 260°C, industrial grade temp, and 40s at peak reflow. Ideal for Other Function uPs & uCs applications due to its high performance and reliability in industrial settings.
MCIMX6Q6AVT10AC by NXP Semiconductors

MCIMX6Q6AVT10AC

NXP Semiconductors

MCIMX6Q6AVT10AC by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.35V to 1.5V. Ideal for automotive applications due to its fine pitch grid array package style and 624 terminals in a square shape.
XC7Z010-1CLG225C by Xilinx

XC7Z010-1CLG225C

Xilinx

The Xilinx XC7Z010-1CLG225C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. Ideal for applications requiring low profile, fine pitch grid array packages in plastic/epoxy material.
ESP32-C3-MINI-1-H4 by Espressif Systems (Shanghai)

ESP32-C3-MINI-1-H4

Espressif Systems (Shanghai)

ESP32-C3-MINI-1-H4 by Espressif Systems is a SoC with 53 terminals, operating at 3.3V, suitable for applications requiring a compact design. With a max supply voltage of 3.6V and operating temperature range from -40 to 105°C, it is ideal for IoT devices and embedded systems needing low power consumption.
LC7981 by Emerging Display Technologies

LC7981

Emerging Display Technologies

Other uPs/uCs/Peripheral ICs;
XCZU4EV-1SFVC784E by Xilinx

XCZU4EV-1SFVC784E

Xilinx

XCZU4EV-1SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has 784 terminals in a GRID ARRAY package style. Suitable for applications requiring high performance uPs/uCs & Peripheral ICs.
ATWINC1510-MR210UB1961 by Microchip Technology

ATWINC1510-MR210UB1961

Microchip Technology

ATWINC1510-MR210UB1961 by Microchip operates at 2.7-3.6V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit in a compact rectangular package style, suitable for industrial applications requiring reliable surface-mount peripherals with TS 16949 screening.
P82B715DG4 by Texas Instruments

P82B715DG4

Texas Instruments

P82B715DG4 by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 12V, operating b/w -40°C to 85°C. It features I2C bus compatibility, clock frequency up to 0.4MHz, and is ideal for industrial applications requiring microprocessor circuits in a small outline package.
ATWINC1500-MR210PB1140 by Microchip Technology

ATWINC1500-MR210PB1140

Microchip Technology

ATWINC1500-MR210PB1140 by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.
C25 by Fcp

C25

Fcp

Other uPs/uCs/Peripheral ICs;
MIMXRT1173CVM8A by NXP Semiconductors

MIMXRT1173CVM8A

NXP Semiconductors

NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.
MCIMX6S5EVM10AB by Freescale Semiconductor

MCIMX6S5EVM10AB

Freescale Semiconductor

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
MCIMX6Q6AVT10ACR by NXP Semiconductors

MCIMX6Q6AVT10ACR

NXP Semiconductors

MCIMX6Q6AVT10ACR by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1.35V to 1.5V and uses BALL terminal form for automotive applications.
CY8C3866AXI-039 by Infineon Technologies

CY8C3866AXI-039

Infineon Technologies

CY8C3866AXI-039 by Infineon: 100-terminal IC with 3.3V supply, 65536 ROM bits, and CMOS technology. Ideal for industrial applications requiring a programmable SoC in a compact, low-profile package. Operates b/w -40 to 85 °C with peak reflow temp of 260 C.
MIMX8MM5DVTLZAA by NXP Semiconductors

MIMX8MM5DVTLZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MM5DVTLZAA is a low-profile, fine-pitch SoC with 486 terminals. Operating b/w 0-95°C, it has a supply voltage range of 0.95-1.05V and peak reflow temperature of 260°C. Ideal for applications requiring high-performance computing in compact spaces.
CY8C4024AZI-S413T by Cypress Semiconductor

CY8C4024AZI-S413T

Cypress Semiconductor

PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Terminal Finish: PURE TIN;
M1A3P600L-1FGG144I by Microchip Technology

M1A3P600L-1FGG144I

Microchip Technology

SoC; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
PN7150B0HN/C11002E by NXP Semiconductors

PN7150B0HN/C11002E

NXP Semiconductors

NXP Semiconductors PN7150B0HN/C11002E is a NFC controller with 40 terminals, CMOS technology, and 1.8V nominal voltage. It operates b/w -30 to 85°C, suitable for applications requiring surface mount chips in plastic/epoxy packages like contactless payment systems.