XCZU7EG-3FBVB900I by Xilinx | Peripheral ICs

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Manufacturer	Xilinx
Manufacturer's Part Number	XCZU7EG-3FBVB900I
Description	MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet	XCZU7EG-3FBVB900I Datasheet
In Stock	400

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Peripheral IC Type:	MICROPROCESSOR CIRCUIT
Nominal Supply Voltage:	.9 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	2.97 mm
Surface Mount:	YES
Terminal Finish:	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Terminals:	900
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Length:	31 mm
Technology:	CMOS
JESD-30 Code:	S-PBGA-B900
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	100 Cel
Peak Reflow Temperature (C):	245
Package Code:	BGA
Width:	31 mm
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	4

Pricing (USD)

Qty.	Unit Price	Ext. Price
400	-	-

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