Xilinx - XCZU7EV-3FBVB900I

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XCZU7EV-3FBVB900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCZU7EV-3FBVB900I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCZU7EV-3FBVB900I Datasheet
In Stock170
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .9 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.97 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Terminals: 900
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 31 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Peak Reflow Temperature (C): 245
Package Code: BGA
Width: 31 mm
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 4
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